Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/05/2019
|
Application #:
|
15649474
|
Filing Dt:
|
07/13/2017
|
|
Publication #:
|
|
Pub Dt:
|
03/08/2018
| | | | |
|
Inventors:
|
Yu-Hsuan TSAI, Sheng-Ming WANG, Kuang-Hsiung CHEN, Yu-Ying LEE, Wun-Jheng SYU
|
|
Title:
|
SEMICONDUCTOR PACKAGE DEVICE HAVING GLASS TRANSITION TEMPERATURE GREATER THAN BINDING LAYER TEMPERATURE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
|
|
|
|
| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007 |
|
|
Search Results as of:
06/26/2024 12:27 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
