Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/23/2018
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Application #:
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15271765
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Filing Dt:
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09/21/2016
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Publication #:
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Pub Dt:
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03/22/2018
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Inventors:
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Eng Fook Chan, Wei Chung Lee, Zhi Wei Low
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Title:
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RADIAL SOLDER BALL PATTERN FOR ATTACHING SEMICONDUCTOR AND MICROMECHANICAL CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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BLAKELY SOKOLOFF TAYLOR & ZAFMAN LLP |
1279 OAKMEAD PARKWAY |
SUNNYVALE, CA 94085-4040 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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SCHWABE WILLIAMSON & WYATT P.C. |
1211 SW 5TH AVE. |
SUITE 1900 |
PORTLAND, OR 97204 |
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