Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/27/2018
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Application #:
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15342241
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Filing Dt:
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11/03/2016
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Publication #:
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Pub Dt:
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03/29/2018
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Inventors:
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Chia-Jung Tu, Chih-Lung Chen, Wen-Hsiang Liao, Chung-Hsiang Wei, Yung-Chi Liu
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Title:
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WAFER DICING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN |
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DEMIAN K. JACKSON |
106 STARVALE LANE |
SHIPMAN, VA 22971 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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SCHIFF HARDIN LLP |
666 FIFTH AVENUE |
17TH FLOOR |
NEW YORK, NY 10103 |
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