Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/31/2019
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Application #:
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15833533
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Filing Dt:
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12/06/2017
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Publication #:
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Pub Dt:
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04/05/2018
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Inventors:
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Stephen St. Germain, Roger M. Arbuthnot, Jay A. Yoder, Dennis Lee Conner
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Title:
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SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5005 E. MCDOWELL ROAD |
| MAILDROP A700 |
| PHOENIX, ARIZONA 85008 |
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| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 E. MCDOWELL ROAD |
| MAILDROP A700 |
| PHOENIX, AZ 85008 |
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Assignment:
2
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PATENT SECURITY AGREEMENT
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| 60 WALL STREET |
| NEW YORK, NEW YORK 10005 |
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| JUSTINE LU/WHITE & CASE LLP |
| 555 SOUTH FLOWER STREET, 2700 |
| LOS ANGELES, CA 90071 |
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Assignment:
3
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RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 046530, FRAME 0494
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| 5005 EAST MCDOWELL ROAD |
| MAILDROP A700 |
| PHOENIX, ARIZONA 85008 |
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| 5005 EAST MCDOWELL ROAD |
| MAILDROP A700 |
| PHOENIX, ARIZONA 85008 |
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| JOANNE HADDAD/WHITE & CASE LLP |
| 1221 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10020 |
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