Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15282473
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Filing Dt:
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09/30/2016
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Publication #:
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Pub Dt:
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04/05/2018
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Inventors:
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Fay Hua, Robert L. Sankman
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Title:
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HIGH DENSITY PACKAGE ON PACKAGE DEVICES CREATED THROUGH A SELF ASSEMBLY MONOLAYER ASSISTED LASER DIRECT STRUCTURING PROCESS ON MOLD COMPOUND
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCHWEGMAN LUNDBERG & WOESSNER, P.A. |
| PO BOX 2938 |
| MINNEAPOLIS, MN 55402-0938 |
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