Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/30/2019
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Application #:
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15727117
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Filing Dt:
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10/06/2017
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Publication #:
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Pub Dt:
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04/19/2018
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Inventors:
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Matthew L. Wasilik, Buu Quoc Diep, Ian Y. Yee, Bang Nguyen, Ebrahim Andideh, Robert Kraft
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Title:
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WAFER-LEVEL-PACKAGED BAW DEVICES WITH SURFACE MOUNT CONNECTION STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7628 THORNDIKE ROAD |
| GREENSBORO, NORTH CAROLINA 27409 |
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| QORVO AND WITHROW + TERRANOVA |
| 106 PINEDALE SPRINGS WAY |
| CARY, NC 27511 |
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