Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/05/2019
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Application #:
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15331614
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Filing Dt:
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10/21/2016
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Publication #:
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Pub Dt:
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04/26/2018
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Inventors:
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Samuel R. CONNOR, Daniel M. DREPS, Jose A. HEJASE, Joseph KUCZYNSKI, Joshua C. MYERS et al
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Title:
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A COMMUNICATION SYSTEM HAVING A MULTI-LAYER PCB INCLUDING A DIELECTRIC WAVEGUIDE LAYER WITH A CORE AND CLADDING DIRECTLY CONTACTING GROUND PLANES
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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PATTERSON SHERIDAN, LLP |
300 N. GREENE STREET |
SUITE 2050 |
GREENSBORO, NC 27401 |
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