Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
12/31/2019
|
Application #:
|
15597124
|
Filing Dt:
|
05/16/2017
|
Publication #:
|
|
Pub Dt:
|
05/03/2018
| | | | |
Inventors:
|
Wei-Yuan Cheng, Yu-Jhen Yang, Chun-Yi Cheng, Shu-Wei Kuo
|
Title:
|
PACKAGE STRUCTURE HAVING UNDER BALL RELEASE LAYER AND MANUFACTURING METHOD THEREOF
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, |
HSINCHU, TAIWAN 31040 |
|
|
|
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
TAIPEI, 100 TAIWAN |
|
|
Search Results as of:
05/13/2024 03:15 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|