Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15674686
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Filing Dt:
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08/11/2017
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Publication #:
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Pub Dt:
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05/10/2018
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Inventors:
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Kim Heng Tan, Chan Wah Chai, Kwai Hong Wong
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Title:
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Substrate Based Fan-Out Wafer Level Packaging
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9TH FLOOR, UBN TOWER, NO. 10 |
| JALAN P. RAMLEE |
| KUALA LUMPUR, MALAYSIA 50250 |
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| ANDREW D. BOCHNER |
| 437 MADISON AVENUE |
| WIGGIN AND DANA LLP, 35TH FLOOR |
| NEW YORK, NY 10022 |
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