Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/10/2019
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Application #:
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15356368
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Filing Dt:
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11/18/2016
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Publication #:
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Pub Dt:
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05/24/2018
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Inventors:
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KUAN-LIANG LU, YEUR-LUEN TU, XIN-HUA HUANG
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Title:
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METHOD OF SEMICONDUCTOR WAFER BONDING AND SYSTEM THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 2301 DUPONT DR. SUITE 510 |
| IRVINE, CA 92612 |
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