Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/26/2019
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Application #:
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15859672
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Filing Dt:
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01/01/2018
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Publication #:
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Pub Dt:
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05/24/2018
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Inventors:
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David Robert Heine, Sean Mathew Garner, Avinash Tukaram Shinde
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Title:
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Substrate Features for Enhanced Fluidic Assembly of Electronic Devices
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5750 NW PACIFIC RIM BOULEVARD |
| CAMAS, WASHINGTON 98607 |
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| DAVID C. RIPMA |
| 5750 NW PACIFIC RIM BLVD. |
| CAMAS, WA 98607 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 TAKUMI-CHO, SAKAI-KU |
| SAKAI CITY, OSAKA, JAPAN 590-8522 |
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| DAVID C. RIPMA |
| SHARP LABORATORIES OF AMERICA, INC. |
| 5750 NW PACIFIC RIM BLVD. |
| CAMAS, WA 98607 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18110 SE 34TH STREET |
| SUITE 480 |
| VANCOUVER, WASHINGTON 98683 |
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| DAVID C. RIPMA |
| SHARP LABORATORIES OF AMERICA, INC. |
| 5750 NW PACIFIC RIM BLVD. |
| CAMAS, WA 98607 |
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