Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/04/2018
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Application #:
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15568140
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Filing Dt:
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10/20/2017
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Publication #:
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Pub Dt:
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05/31/2018
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Inventors:
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Piotr Jozef MICHALIK, Jordi MADRENAS BOADAS, Daniel FERNÁNDEZ MARTÍNEZ
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Title:
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INTEGRATED CIRCUIT COMPRISING MULTI-LAYER MICROMECHANICAL STRUCTURES WITH IMPROVED MASS AND RELIABILITY BY USING MODIFIED VIAS AND METHOD FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TIL·LERS 1A PLANTA, JORDI GIRONA, 31 CATALUNYA |
| BARCELONA, SPAIN 08034 |
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| C/ AUSIÀS MARCH, 1 |
| PALLEJÀ, SPAIN 08780 |
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| MARK MARCELLI |
| VIA LARGA 16 |
| MARIETTI, GISLON E TRUPIANO S.R.L. |
| MILANO, 20122 ITALY |
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