Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/31/2018
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Application #:
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15431909
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Filing Dt:
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02/14/2017
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Publication #:
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Pub Dt:
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05/31/2018
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Inventors:
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Feng-Wei KUO, Wen-Shiang LIAO
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Title:
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INTER-FAN-OUT WAFER LEVEL PACKAGING WITH COAXIAL TIV FOR 3D IC LOW-NOISE PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN ROAD 6 |
HSINCHU SCIENCE PARK |
HSIN-CHU, TAIWAN 300-77 |
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DUANE MORRIS LLP |
30 SOUTH 17TH STREET |
PHILADELPHIA, PA 19103 |
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