Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2019
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Application #:
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15491025
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Filing Dt:
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04/19/2017
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Publication #:
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Pub Dt:
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05/31/2018
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Inventors:
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Jae Sik CHOI, Dong Seong OH, Si Hyeon GO
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Title:
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SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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215 DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO 28429 |
CHEONGJU-SI, KOREA, REPUBLIC OF |
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NSIP LAW |
P.O. BOX 65745 |
WASHINGTON, DC 20035 |
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