Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15724896
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Filing Dt:
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10/04/2017
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Publication #:
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Pub Dt:
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06/07/2018
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Inventors:
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Yongli Feng, Yong fen Chen, Brian Morgan Spahnie, Yan Ni
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Title:
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LED MODULE BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1975 NOBLE ROAD |
| BLDG. 338, NELA PARK |
| EAST CLEVELAND, OHIO 44112 |
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| GENERAL ELECTRIC COMPANY GE GLOBAL PATEN |
| 901 MAIN AVENUE |
| 3RD FLOOR |
| NORWALK, CT 06851 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1975 NOBLE ROAD, BLDG. 338, NELA PARK |
| EAST CLEVELAND, OHIO 44112 |
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| DARREN COLLINS |
| 2000 MCKINNEY AVENUE, SUITE 1400 |
| MCGUIREWOODS LLP |
| DALLAS, TX 75201 |
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