Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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07/24/2018
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Application #:
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15629234
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Filing Dt:
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06/21/2017
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Publication #:
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Pub Dt:
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06/21/2018
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Inventors:
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Bum Wook PARK, Hyun JUNG
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Title:
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METHOD FOR FORMING BUMP OF SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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#712,69,SEONGNAM-DAERO, BUNDANG-GU, |
SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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16, YANGJAE-DAERO 47-GIL, GANGNAM-GU |
SEOUL, KOREA, REPUBLIC OF |
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#1404-1405,23, DONGIL-RO 228-GIL, NOWON-GU, |
SEOUL, KOREA, REPUBLIC OF |
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RICHARD J. STREIT |
LADAS & PARRY, 224 SOUTH MICHIGAN AVE. |
CHICAGO, IL 60604 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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#712, 69, SEONGNAM-DAERO, BUNDANG-GU |
SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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RICHARD J. STREIT |
LADAS & PARRY, 224 SOUTH MICHIGAN AVE. |
CHICAGO, IL 60604 |
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Assignment:
3
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745 SEVENTH AVENUE |
NEW YORK, NEW YORK 10019 |
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CT CORPORATION |
4400 EASTON COMMONS WAY |
SUITE 125 |
COLUMBUS, OH 43219 |
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Assignment:
4
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RELEASE OF SECURITY INTEREST AT REEL 052134 FRAME 0717
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39870 EUREKA DRIVE |
NEWARK, CALIFORNIA 94560 |
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63, RUE DE ROLLINGERGRUND |
L-2440 LUXEMBOURG, LUXEMBOURG |
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2900 S. DIABLO WAY, SUITE 190 |
TEMPE, ARIZONA 85282 |
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CT CORPORATION |
4400 EASTON COMMONS WAY |
SUITE 125 |
COLUMBUS, OH 43219 |
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09/20/2024 09:53 AM
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