Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15382732
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Filing Dt:
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12/18/2016
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Publication #:
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Pub Dt:
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06/21/2018
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Inventor:
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Po-Chun LIN
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Title:
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THREE DIMENSIONAL INTEGRATED CIRCUIT PACKAGE AND METHOD FOR MANUFACTURING THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.669, FUSING 3RD RD., GUEISHAN DIST. |
| TAOYUAN CITY, TAIWAN 333 |
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| CKC & PARTNERS CO., LTD. |
| ROOM 1901, 19/F, LEE GARDEN ONE, |
| 33 HYSAN AVENUE, CAUSEWAY BAY, |
| HONG KONG, HONG KONG |
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