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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/26/2019
Application #:
15396467
Filing Dt:
12/31/2016
Publication #:
Pub Dt:
07/05/2018
Inventor:
Myung Jin Yim
Title:
IN-PACKAGE PHOTONICS INTEGRATION AND ASSEMBLY ARCHITECTURE
Assignment: 1
Reel/Frame:
040843/0949Recorded: 01/04/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/03/2017
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
ALPINE TECHNOLOGY LAW GROUP LLC
9249 S. BROADWAY, UNIT 200-201
HIGHLANDS RANCH, CO 80129

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