Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/27/2019
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Application #:
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15748834
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Filing Dt:
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01/30/2018
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Publication #:
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Pub Dt:
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08/09/2018
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Inventors:
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Yoshihiro USAMI, Shiro AMAGAI
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| AARON L. WEBB |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ORGANIZATION NAME PREVIOUSLY RECORDED ON REEL 044769 FRAME 0566. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 2-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| AARON L. WEBB |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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