Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15428094
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Filing Dt:
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02/08/2017
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Publication #:
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Pub Dt:
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08/09/2018
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Inventors:
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Chris Leitz, Anthony Lochtefeld, Mark Carroll
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Title:
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Thin Film Solder Bond
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 110 CANAL STREET, FLOOR 3 |
| LOWELL, MASSACHUSETTS 01852 |
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| TUTUNJIAN & BITETTO P.C. |
| 401 BROADHOLLOW ROAD, SUITE 402 |
| MELVILLE, NY 11747 |
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