Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/01/2020
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Application #:
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15961865
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Filing Dt:
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04/24/2018
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Publication #:
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Pub Dt:
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08/23/2018
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Inventors:
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BAU-RU LU, MING-CHIA WU, SHAO WEI LU
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Title:
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Three-Dimensional (3D) Package Structure having an Epoxy Molding Compound Layer between a Discrete Inductor and an Encapsulating Connecting Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, RESEARCH & DEVELOPMENT 2ND RD. SCIENCE PARK |
| HSINCHU, TAIWAN 30076 |
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| LITRON INTERNATIONAL PATENT & TRADEMAKRK OFFICE |
| 11F.-2, NO.248, SEC. 3, NANJING E. RD. |
| TAIPEI, 10595 TAIWAN |
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