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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10354964
Issue Dt:
07/16/2019
Application #:
15725677
Filing Dt:
10/05/2017
Publication #:
20180247905
Pub Dt:
08/30/2018
Inventors:
Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Shou Zen Chang, Chao-Wen Shih
Title:
Integrated Devices in Semiconductor Packages and Methods of Forming Same
Assignment: 1
Reel/Frame:
044397/0296Recorded: 12/14/2017Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YU, CHEN-HUA
Exec Dt:
08/15/2017
WU, KAI-CHIANG
Exec Dt:
08/04/2017
LIU, CHUNG-SHI
Exec Dt:
08/08/2017
CHANG, SHOU-ZEN
Exec Dt:
09/11/2017
SHIH, CHAO-WEN
Exec Dt:
08/04/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD.
SUITE 1000
DALLAS, TX 75252
Assignment: 2
Reel/Frame:
054892/0580Recorded: 01/04/2021Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE FOURTH INVENTORS NAME PREVIOUSLY RECORDED AT REEL: 044397 FRAME: 0296. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
YU, CHEN-HUA
Exec Dt:
08/15/2017
WU, KAI-CHIANG
Exec Dt:
08/04/2017
LIU, CHUNG-SHI
Exec Dt:
08/08/2017
CHANG, SHOU ZEN
Exec Dt:
09/11/2017
SHIH, CHAO-WEN
Exec Dt:
08/04/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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