Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2020
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Application #:
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15813553
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Filing Dt:
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11/15/2017
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Publication #:
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Pub Dt:
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09/13/2018
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Inventors:
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Hung-Sen KUO, Te-Wei CHEN, Hung-Sheng CHANG, Ming-Wan KUAN
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Title:
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TEST METHODS FOR PACKAGED INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F-1, NO.36, TAIYUAN ST. |
| JHUBEI CITY, HSINCHU COUNTY, TAIWAN 302 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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