Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/02/2020
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Application #:
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15979403
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Filing Dt:
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05/14/2018
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Publication #:
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Pub Dt:
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09/13/2018
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Inventors:
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Jing-Yao CHANG, Tao-Chih CHANG, Kuo-Shu KAO, Fang-Jun LEU, Hsin-Han LIN, Chih-Ming TZENG et al
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING ROAD, CHUTUNG |
| HSINCHU, TAIWAN 31040 |
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| 5F.-4, NO.502, YUANSHAN RD., ZHONGHE DIST. |
| NEW TAIPEI CITY, TAIWAN 235 |
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| RABIN & BERDO, P.C. |
| 1101 14TH ST., N.W., SUITE 500 |
| WASHINGTON, DC 20005 |
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