Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/23/2019
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Application #:
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15985640
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Filing Dt:
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05/21/2018
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Publication #:
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Pub Dt:
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09/20/2018
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Inventors:
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Paul R. Hart, Shun Meen Kuo, Margaret A. Szymanowski
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Title:
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SEMICONDUCTOR PACKAGES HAVING WIRE BOND WALL TO REDUCE COUPLING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6501 WILLIAM CANNON DRIVE WEST |
LAW DEPARTMENT |
AUSTIN, TEXAS 78735 |
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FREESCALE SEMICONDUCTOR, INC. |
6501 WILLIAM CANNON DRIVE WEST |
TX30/OE62 |
AUSTIN, TX 78735 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE INVENTOR ONE AND DELETE THE TWO PREVIOUS INVENTOR'S PREVIOUSLY RECORDED AT REEL: 46123 FRAME: 431. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TEXAS 78735 |
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FREESCALE SEMICONDUCTOR, INC. |
6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TX 78735 |
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Assignment:
3
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MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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Newly Merged Entity's New Name:
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6501 WILLIAM CANNON DRIVE WEST |
LAW DEPARTMENT |
AUSTIN, TEXAS 78735 |
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NXP USA, INC. |
6501 WILLIAM CANNON DRIVE WEST |
TX30/OE62 |
AUSTIN, TX 78735 |
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