Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/28/2020
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Application #:
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15458649
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Filing Dt:
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03/14/2017
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Publication #:
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Pub Dt:
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09/20/2018
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Inventors:
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DeokKyung Yang, YongMin Kim, JaeHyuk Choi, YeoChan Ko, HeeSoo Lee
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Title:
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SYSTEM -IN-PACKAGE WITH DOUBLE-SIDED MOLDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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10 ANG MO KIO STREET 65 |
TECHPOINT #04-08/09 |
SINGAPORE, SINGAPORE 569059 |
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PATENT LAW GROUP: ATKINS AND ASSOCIATES |
55 N. ARIZONA PLACE |
SUITE 104 |
CHANDLER, AZ 85225 |
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