Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/21/2020
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Application #:
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16018813
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Filing Dt:
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06/26/2018
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Publication #:
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Pub Dt:
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10/25/2018
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Inventor:
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Michel Hendrikus Lambertus Teunissen
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Title:
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Mould, Carrier with Encapsulated Electronic Components, Separated Encapsulated Electronic Component and Method for Encapsulating Electronic Components
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| RATIO 6 |
| DUIVEN, NETHERLANDS 6921 RW |
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| THE WEBB LAW FIRM, P.C. |
| ONE GATEWAY CENTER |
| 420 FT. DUQUESNE BLVD, SUITE 1200 |
| PITTSBURGH, PA 15222 |
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