Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/15/2019
|
Application #:
|
16032085
|
Filing Dt:
|
07/11/2018
|
|
Publication #:
|
|
Pub Dt:
|
11/08/2018
| | | | |
|
Inventors:
|
Shoa Siong LIM, Hwee Seng CHEW
|
|
Title:
|
Multi-Layer Substrate For Semiconductor Packaging
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 10 ANG MO KIO STREET 65 |
| TECHPOINT #04-10 |
| SINGAPORE, SINGAPORE 569059 |
|
|
|
|
| JACE CHEONG |
| 7500A BEACH ROAD |
| #07-324 THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
|
|
Search Results as of:
06/25/2025 01:36 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
