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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/15/2022
Application #:
15773514
Filing Dt:
05/03/2018
Publication #:
Pub Dt:
11/08/2018
Inventors:
Brennen K. MUELLER, Patrick MORROW, Kimin JUN, Paul B. FISCHER, Daniel PANTUSO
Title:
FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCONNECT DEVICE
Assignment: 1
Reel/Frame:
058601/0264Recorded: 12/30/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/16/2015
Exec Dt:
12/16/2015
Exec Dt:
12/16/2015
Exec Dt:
12/17/2015
Exec Dt:
12/29/2015
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
JUSTIN K. BRASK
1211 SW 5TH AVENUE, STE. 1600
PORTLAND, OR 97204

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