Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/16/2019
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Application #:
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15775275
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Filing Dt:
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05/10/2018
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Publication #:
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Pub Dt:
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11/22/2018
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Inventors:
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Yui TAKAHASHI, Katsushi YAMASHITA
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Title:
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RESIN COMPOSITION FOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 140-0002 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD |
| SUITE 100E |
| FALLS CHURCH, VA 22042 |
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