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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
15780621
Filing Dt:
05/31/2018
Publication #:
Pub Dt:
12/06/2018
Inventors:
Wenxin Chen, Cuiming Du, Songgang Chai
Title:
THERMOSETTING RESIN COMPOSITION, PREPREG CONTAINING SAME, LAMINATED BOARD, AND PRINTED CIRCUIT BOARD
Assignment: 1
Reel/Frame:
046260/0979Recorded: 07/03/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/23/2018
Exec Dt:
05/23/2018
Exec Dt:
05/23/2018
Assignee:
NO. 5 WESTERN INDUSTRY ROAD, SONGSHAN LAKE
NATIONAL HIGH-TECH INDUSTRIAL DEVELOPMENT ZONE DONGGUAN
GUANGDONG, CHINA 523808
Correspondent:
NORTON ROSE FULBRIGHT LLP
1301 AVENUE OF THE AMERICAS
NEW YORK, NY 10019-6022

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