Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/15/2020
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Application #:
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16042331
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Filing Dt:
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07/23/2018
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Publication #:
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Pub Dt:
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12/06/2018
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Inventors:
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Wei Lin, Spyridon Skordas, Robert R. Young JR.
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Title:
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GAS-CONTROLLED BONDING PLATFORM FOR EDGE DEFECT REDUCTION DURING WAFER BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| HOFFMAN WARNICK LLC |
| 540 BROADWAY |
| 4TH FLOOR |
| ALBANY, NY 12207 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1891 ROBERSTON ROAD |
| SUITE 100 |
| OTTAWA, CANADA K2H 5B7 |
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| ELPIS TECHNOLOGIES INC. |
| 1891 ROBERSTON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
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