Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/18/2018
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Application #:
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15622078
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Filing Dt:
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06/14/2017
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Publication #:
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Pub Dt:
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12/20/2018
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Inventors:
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Wen-Fang Liu, Shao-Chien Lee, Chen-Wei Tseng, Zong-Hua Li, Chien-Tsai Li
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Title:
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CHIP PACKAGE CIRCUIT BOARD MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.38, XINGBANG RD., KWEI-SAN INDUSTRIAL ZONE, |
TAOYUAN CITY, TAIWAN 333 |
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
7 FLOOR-1, NO. 100 |
ROOSEVELT ROAD, SECTION 2 |
TAIPEI, 100 TAIWAN |
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