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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/18/2020
Application #:
15802556
Filing Dt:
11/03/2017
Publication #:
Pub Dt:
12/27/2018
Inventors:
Nai-Shung CHANG, Tsai-Sheng CHEN, Chang-Li TAN, Yun-Han CHEN, Hsiu-Wen HO
Title:
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE STRUCTURE
Assignment: 1
Reel/Frame:
044025/0839Recorded: 11/03/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/25/2017
Exec Dt:
09/27/2017
Exec Dt:
09/25/2017
Exec Dt:
09/25/2017
Exec Dt:
09/25/2017
Assignee:
ROOM 301, NO.2537, JINKE ROAD, ZHANGJIANG HI-TECH PARK
SHANGHAI, CHINA 201203
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
3100 INTERSTATE NORTH CIRCLE
SUITE 150
ATLANTA, GA 30339

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