Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/01/2019
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Application #:
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15637641
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Filing Dt:
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06/29/2017
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Publication #:
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Pub Dt:
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01/03/2019
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Inventors:
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Georg Seidemann, Bernd Waidhas, Thomas Wagner, Andreas Wolter, Laurent Millou
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Title:
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CROSS-CONNECTED MULTI-CHIP MODULES COUPLED BY SILICON BENT-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCHWEGMAN LUNDBERG & WOESSNER/INTEL |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE RECEIVING PARTY PREVIOUSLY RECORDED ON REEL 043335 FRAME 0725. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCHWEGMAN LUNDBERG & WOESSNER, P.A. |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| ANGELA MILLER |
| C/O CPA GLOBAL |
| 900 SECOND AVENUE SOUTH, SUITE 600 |
| MINNEAPOLIS, MN 55402 |
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