Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/08/2019
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Application #:
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16153878
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Filing Dt:
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10/08/2018
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Publication #:
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Pub Dt:
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02/07/2019
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Inventor:
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Rong- Fa KUO
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Title:
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IMPEDANCE MATCHING STRUCTURE OF TRANSMISSION LINE IN MULTILAYER CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8 LI-SHING 7TH RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 30078 |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD, SUITE 405 |
| VIENNA, VA 22182 |
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