Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/05/2020
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Application #:
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16079965
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Filing Dt:
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08/24/2018
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Publication #:
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Pub Dt:
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02/21/2019
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Inventors:
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In Seob BAE, Sung Il KANG
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Title:
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SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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726, UNGNAM-RO, SEONGSAN-GU |
GYEONGSANGNAM-DO |
CHANGWON-SI, KOREA, REPUBLIC OF 51552 |
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SCHWABE WILLIAMSON & WYATT, PC |
1211 SW FIFTH AVE. |
SUITE 1900 |
PORTLAND, OR 97204 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNORS NAME PREVIOUSLY RECORDED AT REEL: 046701 FRAME: 0651. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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726, UNGNAM-RO, SEONGSAN-GU |
GYEONGSANGNAM-DO |
CHANGWON-SI, KOREA, REPUBLIC OF 51552 |
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SCHWABE WILLIAMSON & WYATT, PC |
1211 SW 5TH AVENUE |
SUITE 1900 |
PORTLAND, OR 97204 |
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09/24/2024 05:34 AM
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