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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10636761
Issue Dt:
04/28/2020
Application #:
16115060
Filing Dt:
08/28/2018
Publication #:
20190067235
Pub Dt:
02/28/2019
Inventors:
Yong-Sung Eom, Seok Hwan Moon, leeseul Jeong, Kwang-Seong CHOI, Keon-Soo Jang et al
Title:
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
046728/0807Recorded: 08/28/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHOI, KWANG-SEONG
Exec Dt:
07/12/2018
EOM, YONG-SUNG
Exec Dt:
07/12/2018
JANG, KEON-SOO
Exec Dt:
07/12/2018
MOON, SEOK HWAN
Exec Dt:
07/12/2018
BAE, HYUN-CHEOL
Exec Dt:
07/12/2018
JUNG, LEESEUL
Exec Dt:
07/12/2018
ALVES BRAGANCA JUNIOR, WAGNO
Exec Dt:
07/12/2018
Assignee:
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
218 GAJEONG-RO, YUSEONG-GU
DAEJEON, KOREA, REPUBLIC OF 34129
Correspondent:
RABIN & BERDO, P.C.
1101 14TH ST., N.W., SUITE 500
WASHINGTON, DC 20005
Assignment: 2
Reel/Frame:
047197/0306Recorded: 10/05/2018Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE SIXTH INVENTORS NAME PREVIOUSLY RECORDED AT REEL: 046728 FRAME: 0807. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
Assignors:
CHOI, KWANG-SEONG
Exec Dt:
07/12/2018
EOM, YONG-SUNG
Exec Dt:
07/12/2018
JANG, KEON-SOO
Exec Dt:
07/12/2018
MOON, SEOK HWAN
Exec Dt:
07/12/2018
BAE, HYUN-CHEOL
Exec Dt:
07/12/2018
JEONG, LEESEUL
Exec Dt:
07/12/2018
ALVES BRAGANCA JUNIOR, WAGNO
Exec Dt:
07/12/2018
Assignee:
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
218 GAJEONG-RO, YUSEONG-GU
DAEJEON, KOREA, REPUBLIC OF 34129
Correspondent:
RABIN & BERDO, P.C.
1101 14TH ST. N.W.
SUITE 500
WASHINGTON, DC 20005

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