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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11189507
Issue Dt:
11/30/2021
Application #:
16084611
Filing Dt:
09/13/2018
Publication #:
20190080942
Pub Dt:
03/14/2019
PCT #:
CN2016076233
Inventors:
Feng YU, Yang LI, Hong Gang WANG, Yong Xin WANG
Title:
CHIP PACKAGING APPARATUS AND METHOD THEREOF
Assignment: 1
Reel/Frame:
047113/0316Recorded: 09/20/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WU, FENG
Exec Dt:
09/18/2018
WANG, HONG GANG
Exec Dt:
09/18/2018
LI, YANG
Exec Dt:
09/18/2018
WANG, YONG XIN
Exec Dt:
09/18/2018
Assignee:
CAPCON LIMITED
ROOM 1101, 11/F, 299QRC
299 QUEEN'S ROAD CENTRAL
HONG KONG, CHINA
Correspondent:
HEIDI A. BOEHLEFELD, ESQ.
1621 EUCLID AVENUE
NINETEENTH FLOOR
CLEVELAND, OH 44115
Assignment: 2
Reel/Frame:
047261/0101Recorded: 10/18/2018Pages: 9
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE 1ST INVENTORS LAST NAME PREVIOUSLY RECORDED AT REEL: 047113 FRAME: 0316. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
YU, FENG
Exec Dt:
09/18/2018
WANG, HONG GANG
Exec Dt:
09/18/2018
LI, YANG
Exec Dt:
09/18/2018
WANG, YONG XIN
Exec Dt:
09/18/2018
Assignee:
CAPCON LIMITED
ROOM 1101, 11/F, 299QRC
299 QUEEN'S ROAD CENTRAL
HONG KONG, CHINA
Correspondent:
HEIDI A. BOEHLEFELD
1621 EUCLID AVENUE
NINETEENTH FLOOR
CLEVELAND, OH 44115

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