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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10297544
Issue Dt:
05/21/2019
Application #:
15716476
Filing Dt:
09/26/2017
Publication #:
20190096802
Pub Dt:
03/28/2019
Inventors:
Yi-Wen Wu, Hung-Jui Kuo, Ming-Che Ho
Title:
INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
Assignment: 1
Reel/Frame:
044077/0440Recorded: 11/09/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WU, YI-WEN
Exec Dt:
10/31/2017
KUO, HUNG-JUI
Exec Dt:
10/31/2017
HO, MING-CHE
Exec Dt:
10/31/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 30078
Correspondent:
JCIPRNET
P.O. BOX 600 TAIPEI GUTING
TAIPEI CITY, 10099 TAIWAN
Assignment: 2
Reel/Frame:
044797/0736Recorded: 11/20/2017Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT PREVIOUSLY RECORDED AT REEL: 044077 FRAME: 0440. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBER FROM 15794003 TO 15716476..
Assignors:
WU, YI-WEN
Exec Dt:
10/31/2017
KUO, HUNG-JUI
Exec Dt:
10/31/2017
HO, MING-CHE
Exec Dt:
10/31/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300-78
Correspondent:
JCIPRNET
P.O. BOX 600 TAIPEI GUTING
TAIPEI CITY, 10099 TAIWAN

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