Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/01/2021
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Application #:
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16205751
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Filing Dt:
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11/30/2018
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Publication #:
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Pub Dt:
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03/28/2019
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Inventors:
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Tsung-Hsien HUANG, Hong-Chen CHENG, Cheng Hung LEE, Hung-Jen LIAO
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Title:
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SEMICONDUCTOR DEVICE HAVING AN INTER-LAYER VIA (ILV), AND METHOD OF MAKING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| HAUPTMAN HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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