Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/01/2022
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Application #:
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16084923
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Filing Dt:
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09/13/2018
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Publication #:
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Pub Dt:
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04/04/2019
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Inventors:
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Ying-shu Quan, Fumio Kamiyama, Kiyotsune Higuchi
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Title:
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MICRONEEDLE PATCH CASE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 32, KAWANISHI-CHO, HIGASHIKUJO, MINAMI-KU |
| KYOTO-CITY, KYOTO, JAPAN 601-8014 |
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| LEE CHENG |
| 1133 13TH STREET N.W. STE C2 |
| WASHINGTON, DC 20005 |
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