Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/05/2020
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Application #:
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16085496
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Filing Dt:
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09/14/2018
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Publication #:
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Pub Dt:
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04/25/2019
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Inventors:
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Sung Il KANG, In Seob BAE
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Title:
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SEMICONDUCTOR PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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726, UNGNAM-RO, SEONGSAN-GU |
GYEONGSANGNAM-DO |
CHANGWON-SI, KOREA, REPUBLIC OF 51552 |
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SCHWABE WILLIAMSON & WYATT, PC |
1211 SW FIFTH AVE. |
SUITE 1900 |
PORTLAND, OR 97204 |
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