Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/30/2020
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Application #:
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16057860
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Filing Dt:
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08/08/2018
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Publication #:
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Pub Dt:
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04/25/2019
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Inventor:
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Hiroyuki NAKAMURA
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Title:
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METHOD OF MANUFACTURING POWER SEMICONDUCTOR MODULE INCLUDING A POWER SEMICONDUCTOR CHIP AND A CONTROL CHIP FORMED ACCORDING TO DIFFERENT PROCESS RULES, AND POWER SEMICONDUCTOR MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8310 |
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| STUDEBAKER & BRACKETT PC |
| 8255 GREENSBORO DRIVE |
| SUITE 300 |
| TYSONS, VA 22102 |
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