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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
15989277
Filing Dt:
05/25/2018
Publication #:
Pub Dt:
05/02/2019
Inventors:
Ji Seok Seo, Jae Jung Kim, Sang Min Park, Yong Deog Kim, Seok Hwan Kim
Title:
Ultra-Low Silicon Wire for Welding Having Excellent Porosity Resistance and Electrodeposition Coating Properties, and Deposited Metal Obtained Therefrom
Assignment: 1
Reel/Frame:
045900/0693Recorded: 05/25/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/16/2018
Exec Dt:
05/16/2018
Exec Dt:
05/16/2018
Exec Dt:
05/16/2018
Exec Dt:
05/16/2018
Assignee:
15TH FLOOR, 507, TEHERAN-RO, GANGNAM-GU
SEOUL, KOREA, REPUBLIC OF 06168
Correspondent:
THE WEBB LAW FIRM
ONE GATEWAY CENTER
420 FT. DUQUESNE BLVD., SUITE 1200
PITTSBURGH, PA 15222

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