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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/19/2019
Application #:
16091155
Filing Dt:
10/04/2018
Publication #:
Pub Dt:
05/02/2019
Inventor:
Seisei OYAMADA
Title:
INTERMEDIATE CONNECTOR, SEMICONDUCTOR DEVICE INCLUDING INTERMEDIATE CONNECTOR, AND METHOD OF MANUFACTURING INTERMEDIATE CONNECTOR
Assignment: 1
Reel/Frame:
047066/0589Recorded: 10/04/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/25/2018
Assignee:
415, AZA-OHTSUBO, OAZA-HONJO, KOMAKI-SHI
AICHI, JAPAN 485-0821
Correspondent:
WENDEROTH, LIND & PONACK, L.L.P.
1030 15TH STREET NW
SUITE 400 EAST
WASHINGTON, DC 20005

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