Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/30/2019
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Application #:
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15856065
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Filing Dt:
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12/28/2017
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Publication #:
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Pub Dt:
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05/02/2019
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Inventors:
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Wei-Yuan Cheng, Shu-Wei Kuo, Shau-Fei Cheng
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Title:
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CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRUCTURE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, |
HSINCHU, TAIWAN 31040 |
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RM.417, BLDG. 52, NO. 195, SEC. 4, CHUNG-HSING RD., CHU-TUNG, |
HSINCHU, TAIWAN |
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JCIPRNET |
P.O. BOX 600 TAIPEI GUTING |
TAIPEI CITY, 10099 TAIWAN |
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