Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/28/2019
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Application #:
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15810163
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Filing Dt:
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11/13/2017
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Publication #:
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Pub Dt:
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05/16/2019
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Inventors:
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Siddharth CHAKRAVARTY, Pradeep YELEHANKA, Sharath Poikayil POIKAYIL SATHEESH et al
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Title:
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WAFER LEVEL PACKAGING FOR MEMS DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 TAMPINES INDUSTRIAL AVENUE 5 |
| SINGAPORE, SINGAPORE |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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