Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/21/2020
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Application #:
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15938271
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Filing Dt:
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03/28/2018
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Publication #:
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Pub Dt:
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05/30/2019
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Inventors:
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Chi-Rui Wu, Fu-Tang Huang, Chia-Cheng Chen, Chun-Hsien Lin, Hsuan-Hao Mi, Yu-Cheng Pai
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Title:
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ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DAFENG RD., TANTZI DIST. |
| TAICHUNG CITY, TAIWAN 427 |
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| MINTZ LEVIN |
| ONE FINANCIAL CENTER |
| BOSTON, MA 02111 |
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