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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10714265
Issue Dt:
07/14/2020
Application #:
16267678
Filing Dt:
02/05/2019
Publication #:
20190172651
Pub Dt:
06/06/2019
Inventors:
Soo Hwan SON, Kyoung Jin JUN, Young Key KIM, Seung Hyun RA, Sang Soo PARK, Soon Ju LEE
Title:
LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME
Assignment: 1
Reel/Frame:
048241/0009Recorded: 02/05/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SON, SOO HWAN
Exec Dt:
02/02/2016
RA, SEUNG HYUN
Exec Dt:
02/02/2016
JUN, KYOUNG JIN
Exec Dt:
02/02/2016
PARK, SANG SOO
Exec Dt:
02/02/2016
KIM, YOUNG KEY
Exec Dt:
02/24/2016
LEE, SOON JU
Exec Dt:
02/24/2016
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MORGAN LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE N.W.
WASHINGTON, DC 20004

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